I decided to share the developer’s story of X505 because it will make a lot of sense for those interested in the idea and how that product was created. Those guys really took time to every little details of the notebook. See it below for yourself. Enjoy.

HIDEKAZU SATO - Project Manager

“VAIO notebook X505 is a product that SONY members as a company from engineering, manufacturing and marketing as a team had been dreaming to produce” says Hidekazu Sato during his story of the X505 development. The challenge to achieve a product lighter that VAIO notebook U was doubtful at the beginning, but as progress was made and designs were put together, the excitement of the project members had rose higher and higher.

A product with Sony’s strong Uniqueness

“The main theme of VAIO Development for year 2003 was “ back to the legendary strength of Product Development ” , which was a big challenge to the project members since the development of the 1 st generation VAIO notebook 505. On the other hand, there was a strong desire from the Sales and Marketing group to introduce a product less than 1kg ( 2.20 pounds ) with one spindle, and showing Sony ’ s uniqueness in design. Soon everybody started to get excited to revive the original 505 with the latest technology. “ , says Hidekazu Sato , leader of VAIO Notebook 505 Extreme project.

Major cut in weigh and thinness,
based on the original 505 design concept

The sensational launch of 1 st generation VAIO notebook 505(PCG-505) on November 20 1997, made a great success in Japan to establish the VAIO brand. The introductions of PCG-505 with a very stylish body surrounded in a magnesium alloy, 10.4 inch LCD, weigh 1.35kg, 23.9mm in height at the thinnest part, were a surprise in size and lightness. Although as the VAIO business grew, cost of material, business results, improvements in manufacturing, stabilized production, became more important factors during the product development. However the VAIO notebook 505 eXtreme project was considered totally opposite, to challenge “the boundary”. Even the initial direction from upper management was “not to consider cost, but to make a product.” That’s how extreme this project was.

Although cost was not a factor of the development, we still needed to set goals to achieve. One of the targets was to compete the weigh of 2 nd generation VAIO notebook U (PCG-U101), which was half the size and weigh only 880g. We had no confidence to achieve below 880g in weigh. Engineers considered very hard and made aggressive approaches to reduce the weigh. Normally the weigh of the product gets bigger during the consideration of electrical noise reduction or heat reduction of the body and CPU. However, each engineering section always had “light and thin” concept during the development process, which made this size possible. As a result PCG-X505/P was less that what was targeted, achieving 825g in weigh. Even more with PCG-X505/SP achieved 785g, which was less than the smallest VAIO notebook PCG-U1 (820g).

The project made progress smoothly facing the critical technical challenges one by one with innovation ideas, such like “mother board with 90% of key components”, “new heat reduction mechanism, without using fan or heat pipe”. This smooth development was due to the fact that engineers didn’t have to consider the cost. However, the moment did arrive when we needed to review the cost, production capability, and product liability. There was no way introducing a product if it was too difficult for production, less liable product features, even though the so thin and light. The last and biggest challenge was to ask the engineers to review those factors, which was not part of the product development consideration till that moment.

YUJIN MORISAWA - Designer

The beauty within the basic simplicity
The overall image concept of X505 was to maintain the simple design concept of VAIO notebook 505 (PCG-505), but highlight the wedge and cylindrical design against the very flat surface to express the thinness. Although added a frame around the keyboard to add strength to the body and key touch. Also considering this X505 as a very stylish mobile machine, we removed the unevenness, connectors, and even labels from the bottom of the body to maximize the beauty of this body.

The concept of beauty, within thinness and simplicity
“I joined this project after engineers had pretty much defined the internal architecture and mother board size” says Mr. Morisawa who designed the VAIO notebook X505. “Normally the first step to consider the design, is to start from the overall layout. However for this project, the original design concept was based on VAIO notebook 505. This design was selected out of several design concept, which was the thinnest design, and taking consideration of the 505 battery, and always reviewing the thinness and simplicity of overall design.”

The PCG-505 was popular with the unique battery design that showed the simplicity of design. Mr. Morisawa based the VAIO notebook X505 design concept to PCG-505, and even considering the usage of same battery as PCG-505, but reducing overall weigh to achieve the goal. The battery was jointed to the wedge to address the sharp design. The keyboard of VAIO notebook X505 is positioned toward the front of the body, and does not have the palm rest space. There were concerns not having a palm rest to a this size of model but as the design mock was created, the need of the palm rest was not likely due to the fact that the body was so thin, that the desk itself was good enough for the palm rest.

Keyboard with a frame to strengthen the
body Key pitch : 17mm Key stroke : 1.5mm

The brain part beneath the front cover with a single VAIO logo design.
Also the key design for heat reduction

Adopting the flow of the first generation of 505, we also used a cylindrical battery. The yellow power source input terminal is implemented on the side.

If you look at the overall design of VAIO notebook X505, you may find the simplicity in unexpected areas. Looking at the cylinder part, you will find all power supply from power connector, battery and power switch lined together. Right in front of the power cylinder is just a flat space, but beneath lies the mother board, HDD, interfaces and PC card slot, which all is considered to be the brain of this computer. Then comes the keyboard. This simple design was a collaborative effort between Mr. Morisawa, and the engineers.

Seamless design between the top and bottom cover. Screw holes also designed to blend within the beauty The uniqueness in beauty with this VAIO notebook X505, is the consideration of the body bottom. “Being a mobile machine, we considered even the bottom of the body an important design element to show the stylish body. Creating one smooth surface by remove the unevenness, connectors, less usage of screws, and even re-designing the screws was part of the design consideration. The bottom of the body is thick at the center and both side of the edge is a bit thinner. Engineers did ask the possibility to make the thickness even to architect the components. However, I wanted to keep this design to keep the thinness not only from the view, but when the user holds this product in their hand” says Mr. Morisawa.

Seamless design between the top and bottom cover.
Screw holes also designed to blend within the beauty

KEI NISHINO - Project Leader & Electrical Engineer Leader

The thinness achieved by reducing the overlaps of components.
The ideal layout to achieve “the world class thinness” was to reduce the overlap of components. Realizing the limitation of space within the body, it took time to select features and components that really needed to be implemented, and take out other features that can be considered to be option or external. Then we really considered how to reduce the size of the mother board and layout all of those necessary components.

Even considering to removing the PC card slot
“There is no way we can remove the mother board, hard disk drive, keyboard, which are the key components of a personal computer. It became very difficult to implement a PC card slot, within the same footprint of original 505 with a slim body. We even considered removing the PC card slot from the body and support it externally” says Mr. Nishino the VAIO notebook X505 project leader and electrical engineer leader. At the moment of this PC card slot discussion, the overall motherboard layout was not finalized, but knowing how tough it was to add the PC card slot within the limited body space, removing it from the body was really considered.

Inside X505. Keyboard at the rear,
HDD, motherboard, PC card slot
from left to right of front

However when the consideration supporting wireless LAN, PHS and modem externally by USB began, we realized the negative usability in mobile computer. We came to the same result as we also considered the development of port replicator or docking station. “PC card does have near future advantage towards the 3 rd generation of communication technology” says Mr. Nishino. As result after several discussion and research, the implementation of PC card slot was decided understanding the challenge to reduce the size of mother board even more.

Bundled Display / LAN adaptor designed with slim magnesium alloy body.

As the implementation of PC card slot and positioning of the keyboard layout was decided, the overall layout had started to appear. However, we realized there were very less options to position the connectors. Each side of the keyboard was hard to consider keeping the thin body design. The rear was blocked with the battery. The upper right side of the body was occupied by the PC card slot. That only leaves the upper left side of the body. Within this limited space, we could only fit 2 connectors for USB 2.0, i.LINK connector with special DC out, and display adapter connector. No room for the remaining network connector and memory stick became our next issue.

Bundled optical mouse with memory stick slot.
Slim design matching the X505 body. (*the mouse is included only with JP models)

“We came up with idea to support memory stick and network connector by a PC card. However, since the PC card slot was considered to be used by a wireless LAN card, we wanted to take a different approach. The electrical circuit for the network was able to be implemented within the mother board, which left the placement of the connector. We then realized there was an open signal pin with the display adapter” says Mr. Nishino. This is how we modified the display adapter to be “display and LAN adapter” and solve the LAN network issue. On the other hand, as we were also considering the positioning of memory stick slot, Mr. Morisawa suggested designing a mouse to match the overall VAIO notebook X505 design. We then changed that plan to develop a mouse with memory stick slot.

AKIHIRO MIYANO - Electrical Engineer – in charge of motherboard

Mother board size same as a MD media
My first project when I joined SONY 5 years ago was the development of VAIO notebook 505 (PCG-N505) motherboard, and then continued joining VAIO notebook C1 project. This time, I have some confidence to reduce the size of the motherboard based on my 5 years experience. When the motherboard size had to be reduced dramatically due to the implementation of the PC card slot, I heard concerns if that were really achievable. I enjoyed this project knowing the gap between my confidence and concerns from other engineers.

Joint effort with manufacturing achieving size reduction of circuit board
“Primary 4 key factor that made the motherboard size same as a MD media are

•  Reduction of components on motherboard
•  Usage of special small components
•  Changing the specification of motherboard architecture
•  Reduce the distance of circuit and components layout

Although, however we come with ideas to reduce the size of the circuit board, all was useless if it was impossible to manufacture. Jointly working with the manufacturing side was also the key factor to test the production process, or adjust the production line to achieve the MD media size motherboard” says Akihiro Miyano, in charge of VAIO notebook X505 motherboard design. Let’s look into the 4 key factors more in detail.

The motherboard just about the size
of a MD media, mostly occupied by
the CPU chipset.

Starting with the reduction of number of components, traditionally circuit designs are based on using reference documents provided by IC manufactures. Those references provides information under many different kind of environment which some may be unnecessary. For example, the on-board memory for VAIO notebook X505 was only 512MB, thus any components for expansion slot was unnecessary. Although not all detail information is provided in the reference document, thus we considered such unnecessary components with caution to avoid any malfunction to what is really needed. As a result about 30% of the overall components was reduced. “Deciding what is really unnecessary is what I call KNOW-HOW” says Miyano.

The top and bottom side of the motherboard
with all key components mounted.

VAIO notebook X505 is using extremely small size transistor components which are primarily used for Cellar Phone, but never with any VAIO products. You may simply imagine that the mother board can be smaller by using much smaller components, but mapping different size components is not that simple. The implementation of such small components within the manufacturing process requires higher quality than larger items. Thus we tested the implementation of the production process at the manufacturing before any component was decided.

The change of motherboard architecture was the use of high density circuit board, which is greater that what you can imagine. We have used a “Double Buildup x2 + 6 Layer Blind Via Hole Core” circuit board which is one of SONY’s advanced technology. Traditionally a via hole that transfer electric signal is “Pierce Via hole” that will pierce through every layer. However the use of “Blind Via hole” technology allows connecting only few layers, which was the perfect technology to create a high density mother board. Also the use of “Double Buildup” technology made it possible to layout all components.

Shortening the distance of each components on the motherboard, forced us to reconsider the traditional rule of “do not positioning any other component within a certain distance”. Such space was allocated due to operational reasons during the manufacturing or to replace the component. We reconsidered all components in details, and shorten the distance of some particular area that had less possibility to replace components. This effort made it possible to accomplish 90% occupation of components on the motherboard, compared to other VAIO notebooks which is about 40 – 70%. “As we designed the motherboard using CAD, the space rule of components that we have selected for VAIO notebook X505 was common across SONY, thus we had to adjust the component layout manually to shorten the distance of each components, which ended to be 101% occupation to the board based on the calculation of CAD” says Miyano.

MITSUKUNI SANO - Mechanical Engineer
Carbon Fiber – the key to achieve below 800g hurdle
Faced the challenges to the body, keyboard and many other technology to achieve “the lightest” personal computer. Especially the use of “layered carbon fiber” with PCG-X505/SP is innovative, which is lighter, stronger, and tougher than magnesium alloy. We have been doing research to use carbon fiber as the next generation VAIO material, and the introduction of VAIO notebook X505 with a 10.4 LCD below 800g was the perfect timing to debut.

Strong body with layered carbon fiber
You can find many elements from “VAIO U” to achieve the light body design. For example, the thickness using magnesium alloy within the LCD panel was reduced from 0.7-0.8mm to 0.4mm. This is something which was considered in a simple way of design within the body, which you may not be able to see. Also the base plate beneath the keyboard also used a 0.4mm magnesium alloy to achieve lightness, yet still keep the toughness, which traditionally have been using aluminum, or stainless materials. Further more, the thickness of the two glass plates within the LCD panel was reduced from 0.4mm to 0.3mm. It has been said that 0.4mm glass was thinnest, but grinding further more, we did achieve 0.3mm. So as you see, there are a lot of elements which made it possible to develop a very light body. And finally the major change was the use of layered carbon fiber with PCG-X505/SP.

“The original 505 challenged the use of magnesium alloy material, which even created a new trend in PC design as we call the Metallic design. Today we have came to the new material, carbon fiber, which is much lighter and twice as stronger than magnesium even used with space shuttle or F1 racing machines. We were able to reduce 20g from each side of the body (top and bottom), total 40g compared with the use of nickel carbon molded design, and that’s how we achieved below 800g. As we have been working hard to reduce the weigh by gram, the reduction of 40g was a major success” says Sano Mitsukuni, mechanical engineer of the VAIO notebook X505 project.

The layered carbon fiber, is a material using carbon fiber only a few micron in diameter, much less than a human hair, aligned in the same direction, which becomes a carbon sheet. Stacking this sheet up to 0.8mm in thickness creates the light and strong body of VAIO notebook X505.

“We have selected this layered carbon fabric sheet, which the fiber is aligned in a single direction with high density, among several other fabric type carbon fibers in the market. However it was very difficult to polish the surface as the fiber becomes loose or create wrinkles when used as exterior material. The production of this panel does take more time and effort with advanced technology and experience, compared to traditional carbon or magnesium material, but I was more excited achieving the body strength and lightness compared to the difficultness” says Sano.

Compared to the use of “ Layered Carbon Fiber Material”, PCG-X505P which uses “Nickel Carbon Molded” panel might look less attractive. Although the use of nickel carbon molded panel was also a new material to be used within VAIO lineup. This material is created by molding short carbon fiber, plastic, and then adding nickel coating, which is much easy to manufacture compared to layered carbon fiber. It is also stronger, tougher than metallic materials such like magnesium alloy. Also nickel coating creates smoother surface, yet still keeping the lightness and strength same as using magnesium alloy material.

AKIRA IGUCHI - Software Leader
graphite sheet and software technology
One of the main topics within the software team was to deliver best performance, within the tough situation not having a fan or a heat sink mechanism to reduce the heat inside the body. That’s why we added a utility application allowing users to adjust the heat reduction level. Although we faced difficulty making adjustments as we considered the variety of each peoples temperature sense, and environment condition. We also implemented a “heat reduction graphite sheet” to control the heat level, which was also a challenge to find the best size and design to maximize the heat reduction performance. Several tests were placed with mechanical engineers to come to a conclusion.

TATSUYA FUNAKI - Software Engineer

The perfect CPU performance with 2 level temperature control mechanism.
We have created 2 level setting “temperature control mode” and “performance mode” to control the eternal heat condition, which users can select either one. The challenge was how to switch from each other mode. Users may feel the heat condition differently from somebody else. There is no standard how users may feel the heat or performance speed, thus creating the right setting for each mode was the tough part.

Heat reduction level, which users can adjust
One of the key elements of VAIO notebook X505’s extreme lightness and thinness was the fact that it is fan less, heat sync less design, which traditionally needed to remove the heat from the CPU or chipset.. Removing both mechanisms from the body made it possible to design such thin body, and a very quite notebook, suitable for a high end model such like X505.

A graphite heat reduction sheet was introduced to this fan less model. The fan less mechanism was last considered with the original 505 model, but as the technology of the CPU grew, it also created more heat that needed to be escaped outside the body. The new graphite heat reduction sheet transfers the internal heat towards the edge of the sheet and less towards upwards or downwards, which is how the heat generated inside the body was reduced. That is the main reason why there are no buttons at the upper space of the keyboard to feel the heat. Also since there are no key components under the keyboard, there are less concerns feeling hot while typing.

“At the beginning, I believed that even though we were able to create a fan less body, we still needed a heat pipe to reduce the heat created inside the body. Although, this was against the original design concept to make a light and thin computer. That is why we had considered using a heat reduction sheet made by graphite to distribute the heat evenly to the body surface. After a number of simulations, testing the material, thickness, size, we came to a point which we all agreed there was enough heat reduction with the new sheet” says Mr. Akira Iguchi, the software develop leader of VAIO notebook X505. Without an efficient heat reduction, the CPU performance will be reduced in order to reduce the heat inside the body. Although it is not much dangerous, depending on the usage situation, the upper part of the body does get hot.

The graphite sheet attached to the bottom of the body. CPU goes to the center part

The additional heat control
application for VAIO.

Mr. Iguchi adds more comment. “Listening to the users voice, there are two opinions. One says they would rather avoid having the computer get hot, than getting the full performance, and others prefer getting the performance even though the body gets hot. That is why we have created an application that controls the body temperature of VAIO notebook X505. The application has two performance mode, which are “temperature control mode” and “performance mode” to control the eternal heat. As default the mode is set to “temperature control mode”, which still performs well enough for regular use. On the other hand usage such like gaming, video editing, which does require high performance, you can then switch to “performance mode” and get full CPU performance”

However, since there was nothing to refer in order to decide the right setting, finalizing those two modes was very difficult. “CPU or chipsets does have a thermometer built inside, which provides the exact temperature. However, how HOT it is really depends to each individuals, or usage environment. What is considered to be hot, what is the reasonable CPU performance, was really up to us” says Mr. Tatsuya, Funaki, heat reduction application engineer

MIYUKI HIRABAYASHI - Designer – carrying case, brief case
We have considered everything from mouse to brief case
As we designed the bag that is bundled with this computer, we considered how to make it look simple. We have tested many materials, and even the way to stitch the material in order to keep the stylish and sharp image of VAIO notebook X505. The brief case design that was bundled with “executive mobile package” was also difficult to produce the black color that comes out of Carbon Fiber materials.

The richness and stylish thinness you see everywhere
One of the other features of VAIO notebook X505 is the variety of accessories bundled together. These accessories were also designed based on Morisawa`s design concept. For example the USB mouse, also has a memory stick slot within the compact body. “As we were designing the main body toward a very slim body, we have come to an idea to design all accessories less height than the main body of VAIO notebook X505. Especially, with the mouse, knowing that it will be used very often next to the body, we really wanted to have the mouse body thin, with simple body, yet does match the main body design” says Mr. Morisawa. You can also see a seamless design from the top to bottom of the mouse, which also matches the main body design.

As for the IEEE802.11b/g wireless LAN card, which we already had a product to meet the specification, we redesigned specially for this VAIO notebook X505 adding a new antenna. The redesign was necessary to match the body line, and also considering all possibilities to reduce the weight. Further more, the consideration to reduce the weigh and thickness was with the display / LAN cable using magnesium alloy body, reducing the length of cables, reducing the size of the USB connectors and so on. “Even considering the design of accessories brings the overall design attractive” says Morisawa, as he explains the details of design within the accessories.

USB mouse, specially designed for X505
with Memory Stick slot (JP models only)

The IEEE802.11b/g wireless LAN card
specially designed for X505 (VAIO US model comes with a/b/g card)

New design carrying case for X505.
Both for main unit and accessory case

It has been over 4 years since the carrying case was bundled with the computer, which the last model was VAIO notebook XR (PCG-XR9Z). “Traditionally the primary objective producing a carrying case was to protect the body from scratches rather than matching the design. However, with this X505, we even considered the carrying case to be simple yet stylish one. That is why this carrying case is unique, as you slide in the main body from the side. We had tested ma n y samples, to come up with the perfect material and design that matched this slim, stylish body” says Ms. Miyuki Hirabayashi, in charge of carrying case and brief case designing.

YUKARI MURAKAMI - Graphic Designer – package design
One more eXtreme, packaging design.
We have considered a new package design, which would make the users get excited the moment they bought the product and even as they open the box. We have considered every packaging element from external packaging, manual, design of recovery CD, and even internal cushion packaging, to keep the overall design of VAIO notebook X505. That’s why the VAIO notebook X505 has a different packaging design to create a rich image.

YOSHIO FUKUMITSU - Package Designer
Even creating excitement when opening the package
Traditionally the main body and carrying case would be packaged separately, to reduce the weigh, which will affect the cushion material to protect the product. However since the body weigh was so light, we have re-designed the packaging design even making the carrying case packaged together, yet still considering a slim packaging addressed by the design group.

A slim packaging with carrying case bundled
You will notice the unique design even with the packaging design as you first get the VAIO notebook X505. “I wanted to match the overall concept of VAIO notebook X505, producing the high quality, slim design even with the packaging. Also even considering how users can get excited as they open the packaging was the other key element as I designed the package working with other engineers” says Morisawa.

The VAIO notebook X505 packaging is different than any other VAIO model packaging. Traditionally the notebook PC was packaged vertically, to remove the product from the box from the top. However with VAIO notebook X505, you can take out the product easily setting the box just the way you would place a PC. Once you open the box, then appears a shining VAIO logo, printed on a box which contains manuals, recovery CDs. This box can be kept to store all necessary things in one place. Beneath the box lies the main body wrapped within the carrying case, and at last the bundled accessories.

“We have considered the traditional packaging style, but we thought it was not appropriate to just stack the product in the carrying case vertically, despite of how nice the outside packaging was designed. That is why we first showed the VAIO logo, one the package was opened. The VAIO logo visually designed to give high quality impression and other manuals, recovery CDs, and carrying case were all designed based on the concept of VAIO notebook X505” says the graphic designer Ms. Yukari Murakami, who was in charge of the packaging.

New slim & stylish package design
including X505 accessories

Total design coordination even with
manuals and recovery CDs.

Executive case specially made to fit VAIO X505 and its accessories.

The reason why the main unit was packaged within the carrying case was to reduce the overall size of the packaging. “It was possible, as the VAIO notebook X505 was so light. If it was slightly heavier, the overall packaging couldn’t pass the drop test or the shock test, which might have even made the carrying case to be packaged separately. However, we did have to consider a new way of packaging to protect the product” says Mr. Yoshio Fukumitsu, in charge of packaging design. The internal packaging needed to be specially designed not showing the middle layer, and even printing colors to those packaging to keep the high quality image.

The exterior printing of the package was also designed specially compared to the previous models. Traditionally the last process of the exterior color printing was to varnish adding a shine to the box. However, during the logistic and as the box was passed abound people, there was a concern with the scratch, fingerprints, and so on made, which even made the packaging a bit cheap. However with this model, the packaging was process to removing the shine and creating a unique black mixed by 4 colors to make the packaging closer to the main unit. Then the package was varnished” says Murakami.

————————————————-THE END—————————————————————

Well, if you had the guts to read through this story, you can now understand what had to be done to realize this idea and create such a superb notebook. I hope you enjoyed it! Feel free to comment.
P.S. Erik, if you feel like this deserves to be a “sticky”, go ahead and pin it. Thanks!

Amazing and well done.. nice pics..

Very nice, thank you.
I made it a sticky.

Erik

thanks for sharing this.

i hope to be an x505 owner soon (in a few months).

Mine is X505P.
That’s great reading these.
Thank you VAIOfreak

Hey Anh,
Welcome to the X505 community!  :wink:

Very interesting read and thanks for the efoort that went into putting it together for the forum. I have drooled after a 505 for ages and don’t think I’m anywhere near getting one yet. I feel that it will become the Mac G4 cube of the notebook world and retain it’s value unlike other notebooks which drop so rapidly in price. Anyone have any idea how many were made?

Awesome vaiofreak. We love our vaios so much ! Just trying to imagine a world without the japanese .. !  :shock:

Ye, I always wondered how many units were made. Ye, without Japanese inginuity, we would be stuck with bulky Dells and HPs.

Great post, a very interesting read!

[quote author=“VAIOfreak”]Ye, without Japanese inginuity, we would be stuck with bulky Dells and HPs.

Yes, not to mention gas-guzzling cars…

VAIOfreak im already more inclined than ever to sell my TR5 and go for the X505. Problem is , i cannot find a unit anywhere. Please let me know you guys, if you happen to find any decent deals around.

Cheers.

Great read! However the pics are no longer there anymore =|

Where are the pics???!!!!!